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Richard Carmody Awarded ABIs Outstanding Committee Member of the Year

Alexandria, Va.Richard Carmody of Adams and Reese LLP (Birmingham, Ala.) is the recipient of the American Bankruptcy Institute’s (ABI) “Outstanding Committee Member of the Year” award. An ABI member since 1985, Carmody received the award for his work as newsletter editor to the Ethics and Professional Compensation Committee over the past year. The award was presented to Carmody at ABI's 17th Annual Southeast Bankruptcy Workshop and Meeting in Amelia Island, Fla., held on July 25-28. "Richard has epitomized the highest level of ABI’s volunteer members since he joined the ABI in 1985," said ABI Vice President-Membership Brian Shaw of Shaw Gussis Fishman Glantz Wolfson & Towbin LLC (Chicago). "ABI is most appreciative of his work over the past year with its membership committees, generally, and, in particular, in his role as the newsletter editor to the Ethics and Professional Compensation Committee." A founding co-chair of ABI's Ethics Committee, Carmody continues to contribute his time and expertise to ABI events and activities. He is ranked by several legal publications in bankruptcy/restructuring and creditor-debtor rights law, including Chambers USA, Best Lawyers and Alabama Super Lawyers. Carmody was inducted as a Fellow in the American College of Bankruptcy in 1999, and currently serves as a director of the College Foundation and a member of its Pro Bono Committee. He is a frequent writer and lecturer on bankruptcy and commercial law topics. ### ABI is the largest multi-disciplinary, nonpartisan organization dedicated to research and education on matters related to insolvency. ABI was founded in 1982 to provide Congress and the public with unbiased analysis of bankruptcy issues. The ABI membership includes more than 13,000 attorneys, accountants, bankers, judges, professors, lenders, turnaround specialists and other bankruptcy professionals, providing a forum for the exchange of ideas and information. For additional information on ABI, visit For additional conference information, visit